The main uses of tin balls include tinplate, flux, organic synthesis, chemical production, alloy manufacturing, as well as the assembly of multiple groups of integrated circuits in the electronics industry and other application scenarios, in addition, can also be used for the determination of arsenic, phosphate reagents, reducing agents, tin products and other application scenarios, a wide range of applications. In the above application scenarios, there are certain requirements for tin balls, but the overall standard of tin balls in circulation on the market does not change much. This article will introduce acceptable standards for tin balls:
1. The size of the tin ball does not violate the current stage of welding PCBA min electrical clearance.
2. If the number of solder joints of single-sided PCBA components is more than 100 points and less than 300 points, the total number of single-sided tin balls with aperture 0.15mm±0.03 is no more than or equal to 10.
3. If the number of solder joints of single-sided PCBA components is more than 300 points, the total number of single-sided tin balls with aperture of 0.15mm±0.03 shall not exceed or ≤15.
4. If the number of solder joints of single-sided PCBA components is within 100 points, the total number of single-sided tin balls with aperture 0.15mm±0.03 is less than or equal to 5.
5. The tin ball is driven in the wash free residue, wrapped under the coating layer, welded to the metal surface, buried under the welding resistance film or components.
PCBA appearance inspection standard is one of the most important standards for acceptance of electronic equipment engineering, that is, IPC standard. According to the main uses of different commodities and the technological needs of different users, the acceptable provisions of tin beads on the surface of PCBA plate after convection back welding will continue to be different, generally in the IPC basically reintegrate the needs of users to specify the acceptance standard.
This is the acceptable range of tin balls. Hope it helps.