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Copper-nickel-silicon alloy foil is a high-strength, high-conductivity copper alloy. In particular, temperature aging treatment is applied to the last stage of the copper-nickel-silicon alloy foil manufacturing process. This effect is like re-calendering, making the material a high-performance precipitation-hardening copper alloy, resulting in the copper-nickel-silicon alloy foil having extremely high strength, high elasticity and heat resistance. |

| Item |
Copper-nickel-silicon Alloy Foil |
|
Standard |
ASTM, AISI, JIS, ISO, EN, BS, GB, etc. |
|
Chemical composition |
Cu, Ni, Si, etc. |
|
Size |
Thickness: 0.09mm~3.0mm Width: 10mm~1000mm Various sizes can be customized |
|
Type |
Flat |
|
Export to |
United States, Australia, Brazil, Canada, Germany, Peru, Japan, Italy, United Kingdom, Arabia, etc. |
|
Transport package |
Wooden box packing or according to customer's request |
|
Price term |
EXW, FOB, CIF, CFR, CNF, etc. |
|
Payment |
T/T, Western Union, L/C, etc. |
|
Certificates |
TUV&ISO&GL&BV,etc. |
|
Elongation |
≥2 |
|
Yield strength |
≥450 |
|
Tensile strength |
≥600 |
|
Application |
It is used to make parts such as electronic and electrical integrated circuits, large and medium power tubes, metering, light-emitting diodes and LED brackets. |




C7025 chemical composition
|
Copper (Cu) |
Nickel (Ni) |
Magnesium (Mg) |
Lead (Pb) |
Zinc (Zn) |
Iron (Fe) |
Silicon (Si) |
|
Margin |
2.2~4.2 |
0.05~0.3 |
≤0.05 |
≤1.0 |
≤0.2 |
0.25~1.2 |

