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Characteristics and properties of solder paste

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Update time : 2022-11-28 16:27:15

The tin with a melting point of 138℃ is called low-temperature tin. When the components of the patch cannot withstand the temperature of 200℃ or above and the patch reflux process is required, the low-temperature solder paste is used for welding process. Up the protection can not withstand high temperature reflow welding parts and PCB, very popular LED industry, its alloy composition is tin bismuth alloy. Some low temperature tin reflux welding peak temperature in 170-200° C.

1. Weldability is not as high temperature solder paste, solder joint gloss dark.

2. The solder joint is very fragile, it is not suitable for the products with strength requirements, especially the products that need to be plugged and removed to connect the socket, and it is easy to fall off. features

1. Melting point 139℃

2. In line with RoHS standards

3. Excellent printability, eliminate the missing sag and the phenomenon of fast junction in the printing process

4. Good wettability, bright and uniform solder joint full

5. No tin bead and tin bridge will be produced when soldering back

6. Long-term paste life, steel mesh printing life is long

7. Suitable for wide process and fast printing of low temperature solder paste is mainly used for radiator module welding, LED welding, high frequency welding and so on.

The above is the characteristics and characteristics of solder paste. If you have more knowledge about solder paste, please contact us.

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