Tellurium copper plate is a very suitable for processing of thermal and conductive materials, but some processing processes are not so simple, plating tellurium copper plate is difficult, believe in the use of copper plating process knows that it is a test of technology and care in the plating process.

There are many ways to electroplate tellurium in the process. One of them is water plating, where the film thickness of the water coating is thicker than that of vacuum sputtering, and because the chemical solution of the water coating is different, it will produce different colors. There are also vacuum plating, vacuum plating target has different coating color, vacuum plating power, vacuum grade will have different color changes. However, there is also sputtering, which involves bombarding the target material with argon ions, knocking the atoms out into a gas phase and depositing a coating on the substrate. Sputtering has a wide range of properties and almost any material can be used in dissolving plating.

There are so many kinds of copper telluride plating, as long as we choose the plating method, we must consider a series of factors, such as the composition of copper telluride elements, hardness, plasticity and so on. These factors are likely to lead to a series of problems such as cracks and loopholes in the processing of copper plating.